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KLT-LSC激光蓝宝石全切割机
Laser Sapphire Full-Cutting Machine
商品货号:ECS002825
商品品牌:北京超立方科技公司
PDF 文档: DownloadKLT-LSC激光蓝宝石全切割机details Document
详细介绍
KLT-LSC激光蓝宝石全切割机
Laser Sapphire Full-Cutting Machine
1.Description(描述)
This machine is a laser sapphire glass full-cutting machine to be processed with a precise laser beam in the field of camera lens and touch ID, and the touch windows of Mobile Phone/PMP, Tablet PC, etc Flat Display products。
This laser sapphire full-cutting machine has the best method with high speed and accuracy, especially the small chip for outline and hole/slot cutting, comparing to the other processing methods.
This laser full-cutting has many merits of high efficiency, high throughput, less utilizing fee with less components exchange.
2.Feature(特色)
Ø Apply full-cutting for every sapphire glass wafer worldwide。
Ø High quality cut various shapes, small chipping size by no touch processing.
Ø Low machine maintenance and utilizing fee by no tool changes, lubricating oils.
Ø Short preparation time for the machine operation and simple operation.
Ø A IR fiber laser with Min. 30μm spot size is used, with considerably stable beam quality.
Ø The machine is equipped with various functions involving the exclusive software and
Ø controller to be effectively processing any contours cutting.
Ø The machine has high positioning accuracy at 1μm and high speed processing at 100mm/sec.
Ø The machine is easy accessible for quick trouble-shooting, since it is composed with all standard components.
Ø The machine has exhaust, vacuum, fixture, etc, various equipments for the micro laser processing and sapphire/glass positioning without any scratches.
Ø The automatic laser full-cutting machine can be supplied with the proper jig/fixture to be fixed by any various mother sapphire glass wafer size, and loading/unloading tools of robot mechanism and CCD vision system as an option of high throughput.
3.Configuration(配置)
Ø Standard machine; Manual loading/unloading
-Automatic loading/unloading system (Option)
-CCD vision system (Option)
Ø Standard Sapphire Glass Wafer Size4inch
Ø Sapphire glass thicknessFrom 0.15mm
4.Specification(规格)
    Laser resonator
X-Y axis movement
    Laser typeFiber laser
    Laser power150W
    Laser peak powerMax。 1。5KW
    Laser sport beam sizeMin。 30um
    Laser beam modeTEM00
    Laser wavelength1070nm
    Pulse width0.2ms
    Q- Switch
    Machine environment
-Temperature15-30 Deg。 C
-Humidity30%-70%
    Linear stage
    Working area150 X 200mm
    Transfer speed100mm/sec
    Accuracy+/-1um
    Repeated accuracy+/-1um
 
Z axis movement
    Ball Screw & LM Guide
    Stroke60mm
    Accuracy+/-10um
 
商品标记

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